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thermocompression_bonding
释义
thermocompression bonding
热压键合
装配积体电路的一种焊接工艺。焊接时从毛细管中引出金属细丝,在焊接部位将金属丝加热并将其压焊在焊接点上。热压键合有球焊、弯焊、楔焊等方式。
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receiving_perforator
receptacle
reception
reception_congestion
recharge_card
recipient
reciprocal
reciprocator
recirculating_loop_memory
reclaimer
recognition
recognition_gate
recognition_time
recognized_private_operating_agency
recommended_standard-232
recommended_standard-422
recommended_standard-423
recon
reconfiguration
reconvergent_fan-out
record
record_aggregate
record_area
record-based_system
record_block
Linux计算机英汉词典包含19493条计算机术语英汉翻译词条,基本涵盖了全部常用计算机术语的翻译及用法,是计算机学习及翻译工作的有利工具。
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更新时间:2025/11/1 6:30:05